Publications

[3]

A. T. Oriola, J. D. Maile, A. Nguyen, H. Do, R. Kumar, and E. J. Payton, “Screening of Refractory High-Entropy Alloy Solidification Behavior Through Laser Glazing,” JOM, vol. 77, pp. 7247–7263, Aug. 2025, doi: 10.1007/s11837-025-07620-8.

[2]

A. T. Oriola, J. D. Maile, A. Nguyen, and E. J. Payton, “Toward an index for predicting additive manufacturability of refractory high-entropy alloys,” JOM, vol. 77, pp. 7222–7234, Jul. 2025, doi: 10.1007/s11837-025-07552-3.

[1]

J. D. Maile, A. T. Oriola, I. P. Giblin, A. Nguyen, and E. J. Payton, “Assessment of hot cracking susceptibility through interdendritic feeding simulations,” Integr. Mater. Manuf. Innov., vol. 14, pp. 212–226, Jun. 2025, doi: 10.1007/s40192-025-00403-8.

Presentations

[3]

J. D. Maile (presenter), A. T. Oriola, A. Nguyen, E. J. Payton. (2024-10-08). Assessment of New Hot Crack Susceptibility Index Based on Interdendritic Pressure Drop Simulations. MS&T24: Materials Science & Technology.

[2]

A. T. Oriola (presenter), A. Nguyen, U. P. Ochieze, S. Josyula, H. Do, J. Maile, A. T. McMillen, W. C. Voellmecke, E. J. Payton. (2024-10-07). Additive manufacturing feasibility of refractory high entropy alloys. MS&T24: Materials Science & Technology.

[1]

E. J. Payton (presenter), A. T. Oriola, A. Nguyen, H. Do, L. Sun, J. Maile. (2024-08-20). Additive manufacturing feasibility of refractory high entropy alloys. 32nd International Materials Research Congress (IMRC2024).